Friday, July 15, 2016

HDI Printed Circuit Board emerges in response to the needs of times

The backgroud:Smart phones, tablet computers and other equipment common usage continues to grow; the device becomes more powerful, smaller and thinner form factor, power saving concept deeply rooted. This makes the limited PCB board needs to carry more electronic components, general PCB manufacturing process has been difficult to meet the needs of the times. So the time of HDI is coming.

What is the advance of HDI printed circuit board:

1. The pcb layout area increase, you can add more function in the limited size.

2. The blind holes, buried holes can be designed between different layers.It is more easy to design.

3. You can do thinner trace and track as the holes can be done by laser machine with 0.1mm, which make the pcb more density interconnect.

The future of HDI printed circuit board:

With more and more smart devices developing in the world, we need more and more high technical and smaller product to work for us. So the HDI Printed circuit board would occurs to a new challenge in the future. We need more new and high technology talent to occurs to solve this problem. But we deeply believe, HDI would step forward and stay in higher stage.

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Tuesday, June 14, 2016

Well Known Aluminum PCB Manufaturer

If you are looking for PCB manufacturer in Aluminum PCB material, this can be the best for you. Aluminum PCB manufacturer is not easy to dealth with, well let' s have a know on Aluminum PCBs. Aluminum Printed Circuit Board is also named Aluminum clad, Metal clad (MCPCB), Thermally conductive PCBs, Insulated Metal Substrate (IMS or IMPCB),aluminum base PCB, etc., is often used in LED lighting products and power hybrid IC (HTC),it is a metal-based CCL which has good heat dissipation function. Normally, single sided board is consisted of three layers: circuit layer (copper foil), insulation layer and metal substrate.

Aluminum Printed Circuit Boards Contain a Thin Layer of Thermally Conductive Dielectric Material that Transfers Heat。There are many names for these products; Aluminum clad, aluminum base, Metal clad printed Circuit Board (MCPCB), Insulated Metal Substrate(IMS or IMPCB), Thermally conductive PCBs,etc… but they all mean the same thing and perform the same way.

How Layers Are Aluminum PCBs Made

A thin layer of thermally conductive but electrically insulating dielectric is laminated between a metal base and a copper foil. The copper foil is etched into the desired circuit pattern and the metal base draws heat away from this circuit through the thin dielectric。

Benefits of Aluminum PCBs

Heat dissipation is dramatically superior to standard FR-4 constructions.The dielectrics used are typically 5 to 10 times as thermally conductive as conventional epoxy-glass and a tenth of the thicknes.Thermal transfer exponentially more efficient than a conventional rigid PCB.Lower copper weights than suggested by the IPC heat-rise charts can be used.

Applications of Aluminum PCBs

Although Power Converters and LEDs are the largest users of these products, Automotive and RF companies are also looking to take advantage of the benefits of these constructions.
While a single layer construction is the simplest, other configuration options are available at Amitron, including:Flexible Aluminum PCBsFlex.One of the newest developments in IMS materials is flexible dielectrics. These materials.feature a polyimide resin system with ceramic fillers which provides excellent electrical insulation, flexibility and of course thermal conductivity. When applied to a flexible aluminum material like 5754 or similar, the product can be formed to achieve a variety of shapes and angles which can eliminate costly fixtures, cables and connectors. Although these materials are flexible, they are intended to be bent into place and remain in place.They are not suited for applications that are intended to be flexed regularly.

Aluminum PCB for LED

LED heat dissipation problem is LED manufacturers the most difficult problem, but can be used aluminum plates, because of the high thermal conductivity of aluminum PCB, heat, and can effectively export the internal heat. Aluminum plate is a unique metal-based CCL, with good thermal conductivity, electrical insulation properties and machinability. We should try to be close to the aluminum base PCB design, reducing the thermal resistance potting segment generated.

Multilayer Aluminum PCBs

Common in the high performance power supply market, multilayer IMS PCBs are made from multiple layers of thermally conductive dielectrics. These constructions have one or more layers of circuitry buried in the dielectric with blind vias acting as either thermal vias or signal vias. While more expensive and less efficient at transferring heat as a single layer designs, they provide a simple and effective solution for heat dissipation in more complex designs.


Friday, January 22, 2016

PCB Assembly

After the printed circuit board (PCB) is completed, electronic components must be attached to form a functional printed circuit assembly, or PCA (sometimes called a "printed circuit board assembly" PCBA). In through-hole construction, component leads are inserted in holes. In surface-mount (SMT - surface mount technology) construction, the components are placed on pads or lands on the outer surfaces of the PCB. In both kinds of construction, component leads are electrically and mechanically fixed to the board with a molten metal solder.
 
There are a variety of soldering techniques used to attach components to a PCB. High volume production is usually done with SMT placement machine and bulk wave soldering or reflow ovens, but skilled technicians are able to solder very tiny parts (for instance 0201 packages which are 0.02 in. by 0.01 in.) by hand under a microscope, using tweezers and a fine tip soldering iron for small volume prototypes. Some parts may be extremely difficult to solder by hand, such as BGA packages.
 
Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed strength for components likely to endure physical stress, while components that are expected to go untouched will take up less space using surface-mount techniques. For further comparison, see the SMT page.
 
After the board has been populated it may be tested in a variety of ways:
 
While the power is off, visual inspection, automated optical inspection. JEDEC guidelines for PCB component placement, soldering, and inspection are commonly used to maintain quality control in this stage of PCB manufacturing.
While the power is off, analog signature analysis, power-off testing.
While the power is on, in-circuit test, where physical measurements (for example, voltage) can be done.
While the power is on, functional test, just checking if the PCB does what it had been designed to do.
 
To facilitate these tests, PCBs may be designed with extra pads to make temporary connections. Sometimes these pads must be isolated with resistors. The in-circuit test may also exercise boundary scan test features of some components. In-circuit test systems may also be used to program nonvolatile memory components on the board.
 
In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the Joint Test Action Group (JTAG) standard. The JTAG test architecture provides a means to test interconnects between integrated circuits on a board without using physical test probes. JTAG tool vendors provide various types of stimulus and sophisticated algorithms, not only to detect the failing nets, but also to isolate the faults to specific nets, devices, and pins.
 
When boards fail the test, technicians may desolder and replace failed components, a task known as rework.