PCB single panel process

Why we use PCB single panel process?
The primary reason for having your boards delivered in an array is to make automated assembly faster and less expensive. Running an array of boards through a pick-and-place machine is far more efficient than sending them through one at a time. Arrays are also desirable because they allow the addition of tooling rails, tooling holes, and fiducials, all of which help your assembler.

PCB single panel process

Cutting→drilling printed circuit→the entire board gold→etching→inspection and printing solder→tin spraying→printing character→forming and finished product inspection→rosin and packaging

Process HASL process PCB double-faced board

Cutting, drilling, copper deposition, board ( thickened copper ), image transfer, electrical copper tin, tin, inspection and printing etching resistance welding, seal character, spray tin, forming, testing, product inspection and packaging

Process HASL process of multilayer pcb board

Open the material, inner layer, inner layer etching, Inner Inspection and melanization ( brown )→→→→plate laminated shooting drill electric ( thickened copper ), pattern transfer ( outer ), electrical copper tin, tin, inspection and printing etching resistance welding, seal character, spray tin, forming, testing, product inspection and packaging

PCB multilayer board finger + HASL process

Open the material, inner layer, inner layer etching, Inner Inspection and melanization ( brown )→→→→plate laminated shooting drill electric ( thickened copper ), pattern transfer ( outer ), electrical copper tin, tin, inspection and printing etching resistance welding, seal characters, gold finger, spray tin, forming, testing, product inspection and packaging

FPC single panel process:

Cutting, drilling, dry film lamination, counterpoint, exposing, developing, etching, stripping, surface treatment, paste coating and pressing, curing and surface treatment, ENIG, seal characters, cutting, electrical measurement, punching, final inspection, packing and shipment

FPC double-faced board process:

Cutting, drilling→ PTH →plating, pretreatment, dry film lamination, counterpoint, exposing, developing, figure plating, pretreatment, dry film lamination, exposure, developing, etching, stripping, surface treatment, paste coating and pressing, curing and ENIG, seal characters, cutting, electrical measurement→punching, final inspection, packing and shipment of stripping,

Technological process of FPC multilayer board

Open the material, inner layer, inner layer etching, Inner Inspection and melanization ( brown )→→→→laminated targeting drilling deposit copper and board ( thickened copper ), pattern transfer ( outer ), electrical copper tin, tin, inspection and printing etching resistance welding, chemical nickel gold, seal characters, forming to test, product inspection and packaging

Rigid PCB flexible node ( FPC ) plate process

Open the material, inner layer, inner layer etching, Inner Inspection and melanization ( brown )→→→→laminated targeting drilling deposit copper and board ( thickened copper ), pattern transfer ( outer ), electrical copper tin, tin, inspection and printing etching resistance welding, chemical nickel gold, seal characters, forming to test, product inspection and packaging.

PCB design and PCB manufacture

In the increasing developed electronic industry, no matter manufacturing for a large multinational tech company or a small electronics company, PCB assembly can be riddled with numerous challenges. Effective assembly requires smooth collaboration between designers, fabricators and manufacturers in order to deliver a high quality circuit board to the market. Mistakes made in design can hold grave consequences to the whole organization, especially where the design failures result in substandard products reaching the market.

Design Services
The design of printed circuit boards (PCBs) is one of the most important steps in manufacturing a quality electronic device. The functionality and efficiency of your electronics depend on the design and layout out of the board (or "brain") of the gadget, meaning that nothing can be left to chance. Through careful attention to detail, the board can be designed to meet all product specifications without wasting any space or utilizing excessive components. A truly qualified electronic design and manufacture contractor can provide you with numerous solutions throughout the design process, such as:

Prototyping - If you have an idea for a device, it can be created - as long as you have the right resources at your fingertips. The design services provided by PCB Company can help to bring your prototype to life, quickly and efficiently. The fast-turnaround will enable you to familiarize yourself with your device, so that you can explain and present it to your prospect clients for future orders. And careful, detailed planning ensures that your product will operate without a hitch.

Review - These individuals have years of industry experience, enabling them to quickly spot any flaws in your design schematics, or areas that could be improved. Ultimately, this could result in more compact, affordable boards, and a faster, more efficient device.

Reworking - In some cases, your team may be stuck on a problem with one of your boards. However, engineers could have experience to help to check and rework these problems.

Manufacturing Assembly Services

It's very important to turn your designs into a reality with skill, speed, and precision.

Skillful assembly production - A reliable electronic design and manufacture company will have a comprehensive understanding of the demands of systems assembly. Assembly Company should have the ability to provide you with a customized solution that may include services like configure/build to order, assembly at the chassis, cage, or rack level, custom cabling, documentation, etc. All of this should be handled in direct compliance with industry standards.

Why do you want to use the halogen free material？

With the development of the industry, we are increasingly demanding to Aluminum pcb material.

Electronic waste, bromine and chlorine compounds plastic products containing halogen flame retardant, PVC, when these products waste burning, easy to produce harmful substances dioxin and acid gas (HCl), through the biological accumulation, damage to the environment and human health, the United Nations international environmental planning has its list of persistent organic pollutants (pops).
Halide widely exist in printed circuit board, welding mask, molding compounds, connectors, and other common electronic products.Such as printed circuit boards in flame retardant containing halogen material, PBB and PBDE toxicity is the most care about people.Circuit boards and electronic products containing halogen in the case of incomplete combustion will produce many byproducts, including dioxins, dioxin and furan compounds (furan - like compound), and acid or corrosive gas, these potentially harmful to environment and human health.At present most of the electric power and communication cable containing halogen, the cable will emit poisonous fog when burnt chemicals.In the event of fire, acid gases from the burning of cables will damage people's nose, mouth and throat, smoke can also make people lost, is difficult to escape the scene of the fire.So the EU ROHS regulations banning in printed circuit board using PBB and PBDE contains both halide material.Now someone is trying to contain halogen in electronic devices limit the use of all materials.When burned, they argue, electronics, bromide material will generate toxic dioxins.They called for a ban on the use of containing halogen material beyond the ROHS initially limit PBB and PBDE.

Halogen free may be after July 1, 2006 ROHS (harmful substances limits) instruction since electronic industry and a green revolution.Compared to the dangers of halide, ROHS directive restricting the use of six kinds of harmful substances of Cd and Pb (lead, cadmium, mercury, Hg, hexavalent chrome CR6, + 4 kinds of heavy metals and  PBDE, two kinds of flame retardants polybrominated biphenyl PBB) risks more spectacularly.

Among them, the lead can harm the nervous system directly;Cadmium can cause harm to the bone, kidneys, the respiratory system.Mercury will harm the central nervous system and kidney system;Hexavalent chromium can cause inherited gene defects;  PBDE and polybrominated biphenyl are strong carcinogenic and teratogenic substances.

From lead free and ROHS to halogen free to Norway for POHS instructions to ban the use of 18 kinds of harmful substances, increasingly stringent environmental requirements for the materials not only can significantly reduce the pollution to the environment of electronic products, also can effectively protect our health.

PCB Design

Printed circuit board design is based on the schematics, circuit designers to achieve the required functionality. Printed circuit board layout design mainly refers to the need to consider the layout of the external connections. Optimize the layout of the internal electronic components. Optimize the layout of metal wires and vias. Electromagnetic protection. Heat dissipation, and other factors. Excellent layout can reduce production costs, to achieve good performance of the circuit and thermal performance. Simple layout can be achieved by hand; complex layout needs the computer-aided design (CAD) implementation.

The circuit arrangement in accordance with the position of each process function of the circuit unit, the signal flow so easy layout, and to maintain the same direction as the signal. The core components of each functional unit centered on him for layout. Components should be uniform, overall, compact arrangement on the PCB, minimize and shorten the leads and connections between the various components. The circuit at high frequency operation, to consider the distribution parameters between components. General circuit should be possible to make components arranged in parallel, so not only beautiful, but also easy to install dry, easy to mass production.

In the design, Aluminum pcb from the assembly point of view, to consider the following parameters:
1) The maximum diameter of the hole according to the material conditions (MMC) and with minimal material conditions (LMC) to decide. A non-porous support such components should be selected diameter, subtracting from the MMC pin holes, resulting in a difference 0.15 -0.5mm between. And the pin strip, the diagonal and non-nominal inner diameter difference between the pin supporting holes will not exceed 0.5mm, and less than 0.15mm.
2) A reasonable place smaller components, so that it will not be covered larger components.
3) The thickness of the solder should not exceed 0.05mm.
4) Screen printing logo cannot intersect any pads Upper half.
5) And the lower half of the board should be the same, in order to achieve structural symmetry. Because asymmetric circuit board may become bent.

Flying Probe test

Flying Probe test is to test some of the major problems of electrical latest solutions. To replace it with a probe needle bed, a plurality of motor-driven can quickly move the probe with the electrical devices of the pin contact and electrical measurements. This instrument was originally designed as a bare board, also requires sophisticated software and program support; has now been able to effectively simulate the online test. Flying Probe Test appearance has changed the test method and the low yield rapid conversion (quick-turn) assembled Rigid-flex pcb. Used to take weeks to develop a test a few hours now, and greatly shorten product design cycles and time to market.

Rapid test development; low cost test methods; flexibility fast conversion; well as in the prototype stage to provide rapid feedback to the designer. Therefore, comparing the traditional ICT, Flying Probe test by reducing the time required to make up for the total test time. Flying Probe test system using the benefits outweigh the disadvantages. For example, during assembly, such a CAD system file received after the start of production hours. Therefore, to test the prototype circuit boards for several hours after assembly, not like ICT, high-cost test development process and fixture may be delayed a few days or even a few months. In addition, due to the simple and quick setup, programming and testing, in fact, the general assembly of technical personnel, and not an engineer, you can operate the test. Flying Probe test also exist the flexibility to do a quick test errors quickly convert and process feedback. Also, because the test does not require flying fixture development costs, so it is a typical testing process can be placed in front of the low-cost systems. And because Flying Probe Tester change and rapid test method to convert low-yield assembly, testing usually takes a few weeks to develop a few hours you can get now.

Automatic optical alignment system and the traditional combination of flying machines, the entire automatic optical alignment can make flying more convenient testing and flying in the image processing software dedicated to digital cameras with the help of more accurate. In the traditional Flying Probe test machine, the installation of Flying dedicated to digital cameras and the corresponding image processing software; flying probe testing throughout the automatic identification and detection of the corresponding position to make flying safe and fast test. Having regard to the requirements for fast and precise flying machine, solid industrial hardware and graphics hardware choice, you should first take into account the lightweight, industrial, optical distortion-free, high-speed image processing algorithms; such testing in the actual process of flying because the industry does not appear to affect the hardware itself, the weight of the test accurate, does not appear lost step, and does not affect the image processing algorithm speed flying probe test.