HDI Printed Circuit Board emerges in response to the needs of times

The backgroud:Smart phones, tablet computers and other equipment common usage continues to grow; the device becomes more powerful, smaller and thinner form factor, power saving concept deeply rooted. This makes the limited PCB board needs to carry more electronic components, general PCB manufacturing process has been difficult to meet the needs of the times. So the time of HDI is coming.

What is the advance of HDI printed circuit board:

1. The pcb layout area increase, you can add more function in the limited size.

2. The blind holes, buried holes can be designed between different layers.It is more easy to design.

3. You can do thinner trace and track as the holes can be done by laser machine with 0.1mm, which make the pcb more density interconnect.

The future of HDI printed circuit board:

With more and more smart devices developing in the world, we need more and more high technical and smaller product to work for us. So the HDI Printed circuit board would occurs to a new challenge in the future. We need more new and high technology talent to occurs to solve this problem. But we deeply believe, HDI would step forward and stay in higher stage.

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China Interconnect(HDI) PCB manufacturer

Well Known Aluminum PCB Manufaturer

If you are looking for PCB manufacturer in Aluminum PCB material, this can be the best for you. Aluminum PCB manufacturer is not easy to dealth with, well let' s have a know on Aluminum PCBs. Aluminum Printed Circuit Board is also named Aluminum clad, Metal clad (MCPCB), Thermally conductive PCBs, Insulated Metal Substrate (IMS or IMPCB),aluminum base PCB, etc., is often used in LED lighting products and power hybrid IC (HTC),it is a metal-based CCL which has good heat dissipation function. Normally, single sided board is consisted of three layers: circuit layer (copper foil), insulation layer and metal substrate.

Aluminum Printed Circuit Boards Contain a Thin Layer of Thermally Conductive Dielectric Material that Transfers Heat。There are many names for these products; Aluminum clad, aluminum base, Metal clad printed Circuit Board (MCPCB), Insulated Metal Substrate(IMS or IMPCB), Thermally conductive PCBs,etc… but they all mean the same thing and perform the same way.

How Layers Are Aluminum PCBs Made

A thin layer of thermally conductive but electrically insulating dielectric is laminated between a metal base and a copper foil. The copper foil is etched into the desired circuit pattern and the metal base draws heat away from this circuit through the thin dielectric。

Benefits of Aluminum PCBs

Heat dissipation is dramatically superior to standard FR-4 constructions.The dielectrics used are typically 5 to 10 times as thermally conductive as conventional epoxy-glass and a tenth of the thicknes.Thermal transfer exponentially more efficient than a conventional rigid PCB.Lower copper weights than suggested by the IPC heat-rise charts can be used.

Applications of Aluminum PCBs

Although Power Converters and LEDs are the largest users of these products, Automotive and RF companies are also looking to take advantage of the benefits of these constructions.
While a single layer construction is the simplest, other configuration options are available at Amitron, including:Flexible Aluminum PCBsFlex.One of the newest developments in IMS materials is flexible dielectrics. These materials.feature a polyimide resin system with ceramic fillers which provides excellent electrical insulation, flexibility and of course thermal conductivity. When applied to a flexible aluminum material like 5754 or similar, the product can be formed to achieve a variety of shapes and angles which can eliminate costly fixtures, cables and connectors. Although these materials are flexible, they are intended to be bent into place and remain in place.They are not suited for applications that are intended to be flexed regularly.

Aluminum PCB for LED

LED heat dissipation problem is LED manufacturers the most difficult problem, but can be used aluminum plates, because of the high thermal conductivity of aluminum PCB, heat, and can effectively export the internal heat. Aluminum plate is a unique metal-based CCL, with good thermal conductivity, electrical insulation properties and machinability. We should try to be close to the aluminum base PCB design, reducing the thermal resistance potting segment generated.

Multilayer Aluminum PCBs

Common in the high performance power supply market, multilayer IMS PCBs are made from multiple layers of thermally conductive dielectrics. These constructions have one or more layers of circuitry buried in the dielectric with blind vias acting as either thermal vias or signal vias. While more expensive and less efficient at transferring heat as a single layer designs, they provide a simple and effective solution for heat dissipation in more complex designs.

PCB Assembly

After the printed circuit board (PCB) is completed, electronic components must be attached to form a functional printed circuit assembly, or PCA (sometimes called a "printed circuit board assembly" PCBA). In through-hole construction, component leads are inserted in holes. In surface-mount (SMT - surface mount technology) construction, the components are placed on pads or lands on the outer surfaces of the PCB. In both kinds of construction, component leads are electrically and mechanically fixed to the board with a molten metal solder.

 

There are a variety of soldering techniques used to attach components to a PCB. High volume production is usually done with SMT placement machine and bulk wave soldering or reflow ovens, but skilled technicians are able to solder very tiny parts (for instance 0201 packages which are 0.02 in. by 0.01 in.) by hand under a microscope, using tweezers and a fine tip soldering iron for small volume prototypes. Some parts may be extremely difficult to solder by hand, such as BGA packages.

 

Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed strength for components likely to endure physical stress, while components that are expected to go untouched will take up less space using surface-mount techniques. For further comparison, see the SMT page.

 

After the board has been populated it may be tested in a variety of ways:

 

While the power is off, visual inspection, automated optical inspection. JEDEC guidelines for PCB component placement, soldering, and inspection are commonly used to maintain quality control in this stage of PCB manufacturing.

While the power is off, analog signature analysis, power-off testing.

While the power is on, in-circuit test, where physical measurements (for example, voltage) can be done.

While the power is on, functional test, just checking if the PCB does what it had been designed to do.

 

To facilitate these tests, PCBs may be designed with extra pads to make temporary connections. Sometimes these pads must be isolated with resistors. The in-circuit test may also exercise boundary scan test features of some components. In-circuit test systems may also be used to program nonvolatile memory components on the board.

 

In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the Joint Test Action Group (JTAG) standard. The JTAG test architecture provides a means to test interconnects between integrated circuits on a board without using physical test probes. JTAG tool vendors provide various types of stimulus and sophisticated algorithms, not only to detect the failing nets, but also to isolate the faults to specific nets, devices, and pins.

 

When boards fail the test, technicians may desolder and replace failed components, a task known as rework.

Through Hole and Surface Mounted Technology

Through Hole Mounting: This mounting technique involves different components which have lead wires that are led to the board through holes, hence the name. In this method, leadsrely on holes in a multilayer PCB. The leads are then finally soldered to offer permanent mounting. The technology finds usage inDIP aka Dual Inline Packaging and Pin Grid Array Package.

Surface Mounting: This is a relatively new mounting method worked out seeing a tremendous increase in the number of pins in Integrated Circuits. As demand for smaller weight and size of packaged weight increased, there was felt a need for a new, improved technology that came to be known as surface mount technology (SMT). In this leads are soldered on PCB surface directly rather than using hole mounting. The technology is used in Flat pack Packages and Chip Carrier Packages.

There are some points that make SMT different from Through Hole, which has been briefly summarized below:

1. SMT has helped significantly in solving the space problems that were commonly noticed with the Through Hole mounting.
2. The pin count has increased greatly in SMT when compared to its older counterparts.
3. In SMT, the components are leadless and are directly mounted to the board surface. In Through Hole the components have lead wires that are taken to the wiring boards via holes.
4. The Pads on the surface in SMT are not used for connection of layers on the printed wiring boards.
5. The components in the Though Hole Technology are larger which leads to lower component density per unit area. The packing density that can be achieved with SMT is very high as this allows mounting component on both sides, when needed.
6. SMT has made possible applications that seemed impossible with through hole.
7. SMT is suitable for high volume production that gives access to lowered cost of unit assemblies which is not possible with through hole technology.
8. With SMT acquiring higher circuit speed is easier due to the reduced size. SMT fulfils one of the prime marketing requirements while assisting in making high performance circuits in a very small size.
9. SMT has a disadvantage as the capital investment involved in its machinery and production is higher.

10. Designing, production, skill and technology required in implementing SMT is very advanced when compared to through hole technology.When comparing both, SMT surpasses Through Hole in advantages, which clearly define and justify the majority (90%) use of this technology in board assemblies. Through Hole however is anticipated to remain in use in testing and prototype applications that may need manual adjustments and replacements. Its complete disappearance from the scene seems to be ruled out.

When to send a developing mail to your customers

4 layer PCB

(click pic above to see more)

As everyone knows, it is very important to know to how to write a good developing mail to customers. When you surf in the internet and you may find many good examples. But does it mean you are successful when you get one good mail?

Obviously, the answer is “no”. You should know how the customers work in one daytime and then you know when to send a developing mail to your customers. It is the best time to send a mail to clients in their morning time of 9:00 -10:00 when they are receptive to offers on a whole range of the subjects at their starting work in one day. At 10:00 to noon time, customers begin to be focused on their own job. So please don’t disturb them during this time. When it comes to 12:00--2:00 pm., it is lunch break time, and most of them are likely to do some reading on news and magazines while they are not usual to open their market emails. During 2pm--3pm, in the immediate post- lunch period, customers remain focused on work, only responding to emails offer relating to financial services. 3pm--5pm, a life changing afternoon, job related apathy sets in, meaning more emails relating to property and financial services are opened than any other type of promotion. At 5pm to 7pm, working late, there is a dramatic rise in holiday promotions being opened during this period. This is also the timeframe during which recipients are more likely to open b2b promotions. At 7pm to 10pm, the last orders, recipients are more likely to respond to customers promotions in their own time. Offers on clothes and special interests such as sports and gym promotions  perform extremely well during this period.  And finally, during 10pm to 9 am, it is the abyss, and it is an impressive time to send mails to customers. It is just like to throw emails into a black hole.

In conclusion, you should know how to write a good developing email at first. But when to send a developing mail to your customers seems most important.

PCB board PCB manufacturer PCBA manufacturer Wonderful PCB

Aluminum PCB board Application

WDF - aluminum pcb 019, wonderfulpcb.com

Led aluminum board thermal conductivity

Led aluminum board and thermal conductivity aluminum board in the middle of the insulating layer (generally is PP, now has a thermal conductive adhesive, etc.), it is one of the three major measure of aluminum plate quality, heat resistance and pressure value is another two performance).Aluminum plate thermal conductivity can be tested after plate bonding instrument tests data, the high value of thermal conductivity is generally ceramic, copper, etc., but due to the cost into consideration, is currently on the market mainstream electronic aluminum plate, aluminum plate thermal conductivity of the corresponding is parameters of people's concern, the higher the coefficient of thermal conductivity is one of the symbols of the better performance.

Led aluminum plate classification

Led fluorescent lamp aluminum plate is aluminum plate classification, street light aluminum plate, tube light aluminum plate, wall lamp aluminum plate, shoot the aluminum plate, energy-saving light aluminum plate, electrodeless lamp aluminum plate, aluminum board, ceiling aluminum plate, wash wall lamp aluminum plate, the ball bubble lamp aluminum plate, tunnel light aluminum plate, floodlight, aluminum plate, aluminum plate, wall lamp high-power aluminum plate, small power aluminum plate, guardrail tube aluminum plate, neon lights aluminum plate, corn lamp aluminum plate, the candle light aluminum plate, absorb dome light aluminum plate, kitchen lamp aluminum plate, corridor lights aluminum plate, buried lights aluminum plate, dared light aluminum plate, industrial and mining lamp aluminum plate, aluminum plate bridge lights, floor tile lamp aluminum plate, stair light aluminum plate.

LED aluminum plate insulating layer

LED aluminum plate insulation layer is one of the most core technology of aluminum plate, the main adhesive, insulation and thermal conductivity of the function.Aluminum base board insulation is a power module.

Structure of the largest thermal barrier.Insulation heat conduction performance, the better, the more conducive to the spread of the heat produced during the operation, will be conducive to reduce the operating temperature of the device, so as to improve the module of power load, reducing the volume and prolong life, improve the power output, etc.

LED aluminum plate

1, audio equipment: input, output amplifier, balanced amplifier, audio amplifier, preamplifier, power amplifier, etc.  

2, power equipment, switching regulator ` DC/AC converter ` SW regulator, etc.  
3, communication electronic equipment: high frequency increase ` filtering electrical ` transmitting circuit.  

4, office automation equipment, motor drives, etc.  

5, automobile, electronic regulator ` igniter ` power controller, etc.  

6, a computer: CPU board ` diskette drive ` power supply device, etc.  

7, power module, inverter ` solid relay ` rectifier bridge, etc